IS-I-700 Modular


The IS-I-700 Modular is based on the same concept as the IS-I-460 Modular, with this system you are prepared for the future, its capable to solder boards up to 700x700mm. The automatic width adjustment of the conveyor such as SMEMA is standard.



InterSelect Modular systems consist of a flux module, preheat module and solder module. These modules can be set one behind the other in which our customers can adjust the system to their needs. Despite the small footprints of just 5m² for the IS-I-700 Modular soldering system can accommodate very large boards of 700x700mm - space efficiency is second to none! As Inline systems with automatic width adjustment of the conveyor, all IS-I-700 modules can be integrated in a production line or between a PCB loader and unloader.



Two IS-I-700 S soldering modules



Ideally suited for high throughput requirements. This variant results in a reduction of cycle time. Parallel processing with two soldering units and use of best solder nozzle dimensions with small solder nozzle in the first machine for solder joints and large solder nozzle in the second machine, consequently throughput of boards will be at least doubled.

Fluxing module IS-I-700 FM, preheat module IS-I-700 PM and IS-I-700 SM soldering module



Ideally suited for high mass assemblies which need to be preheated or need long preheat cycles. Fluxing, preheat and soldering are performed simultaneously. Because the soldering process usually is the most time-consuming process, it determines the cycle time.

Fluxing module, preheat module and two IS-I-700 S soldering modules.



For very high thruput and boards up to 700x700mm this configuration is predestined, the machine can as well used with two diffterent nozzle diameters for small nozzle & big nozzle or for two different alloys (Lead-free and Leaded)


The turnkey-machine is set up and installed easy and can start production right after uncrating.


Solder Pot

All InterSelect selective soldering machines have a Titan solder pot which can handle all kinds of solder alloy. By default the machine is equipped with nitrogen insertion and cover. The intelligent setting makes maintenance and cleaning of the solder pot and the solder simple and quick.



The MicroDrop-Jet Fluxer has a Flux-Tank with pressure control and accepts alcohol- and water-based flux types. With an accuracy and repeatability of ± 0.1mm the micro-drop Fluxer reaches a speed of up to 200mm/s  



The optional Top- and Bottom-Preheater with infrared emitters can be adjusted depending on the board size to ensure energy-efficient production. While preheating a pyrometer control measures the exact temperature right on the PCB surface and continuously regulates the heating power.


PC and Software

The machine has an integrated PC running Windows 7 and pre-installed machine software. The soldering solftware features 3 password protected user levels and is designed with an emphasis on intuitive operation.

Technical Spécifications:

Footprint:3870 x 1242 x 1372mm ( LxBxH)

PCB holder:Length min.max. 50-700mm
.Width min.max. 50-700mm
.Components above up to 120mm
.Components below up to 40mm
.Max weight 15 KG

Energy3 phase / 400V
.1,3 m³/h N2 bei 99,99% 
.3-6 bar compressed air

PreheatingIR Heater from 1,5 up to 4,5 KW above
.IR Heater from 1,5 up to 4,5 KW below

Solder pot12 KG
.Pump unit made of titanium
.Pot made of titanium

Video Youtube

Vidéo Youtube


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